Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

Jaewoo Shim, Sang‐Hoon Bae, Wei Kong, Doyoon Lee, Kuan Qiao, Daniel Nezich, Yong Ju Park, Ruike Renee Zhao, Suresh Sundaram, Xin Li, Han‐Wool Yeon, Chanyeol Choi, Hyun S. Kum, Ruoyu Yue, Guanyu Zhou, Yunbo Ou, Kyusang Lee, Jagadeesh S. Moodera, Xuanhe Zhao, Jong‐Hyun Ahn, Christopher L. Hinkle, A. Ougazzaden, Jeehwan Kim

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Record

Archive ID
doi:10.1126/science.aat8126
Published
Oct 11, 2018
Venue
Science
DOI
10.1126/science.aat8126
PubMed
30309906
Categories
2D Materials and Applications
Provenance
openalex

Topics